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Available technologies

Sealing & brazing

We talk about “glass-to-metal” hermetic packages when the perfect hermetic seal of the connection pins is ensured by glass beads and about “ceramic-to-metal” hermetic packages, technology which is rarer and more difficult to achieve, when hermeticity and interconnection are ensured by ceramic inserts instead of glass beads.

  •  Glass-To-Metal-Seal 
    Egide masters both types of hermetic sealing technologies for its GTMS packages.
  • Compression sealing
    The reliability of the seal is guaranteed by the thermal expansion of glass and metal creating the necessary concentric compressive stress to meet stringent hermeticity requirements.
  •  Matched sealing 
    This sealing process used the match of the thermal expansion coefficients of Kovar and glass over a wide temperature range. An oxide layer created between metal and glass provides for the hermeticity and electrical insulation.
  •  Ceramic-to-Metal-Seal 
    Microelectronics and opto-electronics application have driven the need for more and more complex interconnection solutions.
    Egide’s multilayer HTCC technology provides for innovative solutions that meet this requirement. Miniaturization of your designs is possible using the CTMS technology.
    Our Alumina (Al2O3) multilayer ceramics are brazed together with complex metal housings to ensure hermeticity.
  •  Brazing or soldering process 
    Using a preform of metal alloy melted at higher or lower temperature metal and ceramic components are sealed together.
    Egide masters high temperature brazing and low temperature soldering.

High temperature cofired ceramic process HTCC

High Temperature Cofired Ceramic (HTCC) technology is a perfect match for the increasingly complex micro-electronics and opto-electronics designs used in harsh environments.

Density of interconnection make it possible to miniaturize design where traditional GTMS solutions fail.

Its very high frequency capabilities through design make it ideal for high speed data transmission networks.

Egide handle all process steps in-house on its proprietary HTCC technology: the transformation of the raw ceramic in a class 10,000 clean room, via and window punching, screen printing of the conductive tracks, pressing, and cutting.

Conductive inks are developed and made internally. Then coming to the final ceramic through a proprietary firing process.


Plating

Egide’s great expertise in the area of surface treatment, and the integration of the line into the work flow are major strengths for ensuring optimal quality in the finished product.

Electrolytic or chemical deposits (gold, nickel or silver).

Semi-automated, or manual surface treatment production lines, depending on the manufacturing site and the applications.